Apparatus and method for managing voltage buses

ABSTRACT

The present technique relates to a method and apparatus for managing voltage buses. In a memory device, such as SRAM or DRAM, a periphery voltage bus may supply voltage to periphery circuitry and an array voltage bus may supply voltage to array circuitry. A bridge circuit may be utilized to isolate the buses from each other and couple the buses together, depending on the control signals are received by the bridge circuit. As such, the bridge circuit enhances the operation of the memory device by reducing duplicative circuits and equalizing the voltage that are applied to the buses. In addition, the bridge circuit isolates the buses from each other to protect sensitive circuitry in the array and periphery circuitry from noise on the other bus.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.10/750,735, which was filed on Dec. 31, 2003.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates generally to semiconductor devices and,more particularly, to the distribution of power in array and peripherysections of a semiconductor device, such as a memory device.

2. Description of the Related Art

This section is intended to introduce the reader to various aspects ofart which may be related to various aspects of the present inventionwhich are described and/or claimed below. This discussion is believed tobe helpful in providing the reader with background information tofacilitate a better understanding of the various aspects of the presentinvention. Accordingly, it should be understood that these statementsare to be read in this light, and not as admissions of prior art.

Microprocessor-controlled integrated circuits are used in a wide varietyof applications. Such applications include personal computers,telephones, vehicle control systems, networks, and a host of otherconsumer products. Typically, microprocessors are essentially genericdevices that perform specific functions under the control of a softwareprogram. This program is stored in a memory device that is coupled tothe microprocessor. Not only does the microprocessor access one or morememory devices to retrieve the program instructions, but it also storesand retrieves data created during execution of the program in the memorydevices.

It should be understood that memory devices, which may be asemiconductor chip, include integrated circuits that are typically massproduced through fabrication processes. In forming the chip, differentmaterials are layered together to form various structures or circuitrywithin the chip. These structures are connected together to exchangesignals, distribute power within the chip and receive power fromexternal devices, among other things. Additionally, the semiconductorchip may be divided into different sections, such as the array sectionand the periphery section. The array section may include memorystructures, such as memory cells and banks that are used to store data,while the periphery section may include larger structures that supportthe array section, such as drivers, interconnects between circuitry,decoders or other similar circuitry.

Regardless of the specific structures within the semiconductor chipbeing fabricated, it is often desirable to conserve power and to ensurethat the power distributed to various circuits is provided in aconsistent and steady manner. For instance, in a personal computingdevice, the configuration and layout of components may affect theoperation and efficiency of the device. device. During a power-up phase,different sections of the chip, such as the periphery and arraysections, may not reach a specified voltage at the same time. Thisvariation in time may result in the chip taking longer to power up froman initialization or standby mode to an operation mode because one ofthe sections takes longer to reach the operational voltage. As a result,these inefficiencies may reduce the amount of time that the device isable to operate in an active or standby mode.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing and other advantages of the present technique may becomeapparent upon reading the following detailed description and uponreference to the drawings in which:

FIG. 1 illustrates a block diagram of an exemplary processor-baseddevice in accordance with the present technique;

FIG. 2 illustrates a block diagram of an exemplary embodiment of asemiconductor chip used in the processor-based device of FIG. 1;

FIG. 3 illustrates a block diagram of an alternative exemplaryembodiment of a semiconductor chip used in the processor-based device ofFIG. 1 in accordance with aspects of the present technique;

FIG. 4 illustrates a block diagram depicting a more detailed exemplaryembodiment of embodiment of the power distribution system in thesemiconductor chip of FIG. 3 in accordance with aspects of the presenttechnique;

FIG. 5 illustrates a graph of time periods associated with variouscircuits to reach a specified voltage;

FIG. 6 illustrates a schematic diagram depicting an exemplary embodimentof the bridge circuit of FIGS. 3 and 4 in accordance with aspects of thepresent technique; and

FIG. 7 illustrates a process flow diagram of the bridge circuit of FIGS.3 and 4 in accordance with aspects of the present technique.

DETAILED DESCRIPTION OF SPECIFIC EMBODIMENTS

One or more specific embodiments of the present invention will bedescribed below. In an effort to provide a concise description of theseembodiments, not all features of an actual implementation may bedescribed in the specification. It should be appreciated that in thedevelopment of any such actual implementation, as in any engineering ordesign project, numerous implementation-specific decisions are made toachieve the developers' specific goals, such as compliance withsystem-related and business-related constraints, which may vary from oneimplementation to another. Moreover, it should be appreciated that sucha development effort might be complex and time consuming, but wouldnevertheless be a routine undertaking of design, fabrication, andmanufacture for those of ordinary skill having the benefit of thisdisclosure.

The present technique is an improved approach for managing voltage busesto conserve power and to ensure that the power distributed to variouscircuits is provided in a consistent and steady manner. Under thepresent technique, a bridge circuit may be utilized to connect voltagebuses together or isolate voltage buses from each other to enhance theoperation of circuitry within a semiconductor chip. The bridge circuitmay be controlled by control signals associated with different modes ofoperation within the semiconductor chip. As a result of the bridgecircuit, the operation of the semiconductor chip may be enhanced becausethe problems associated with different voltages being applied to thedifferent circuitry may be diminished. In addition, duplicate componentsmay be removed to further reduce leakage within the semiconductor chip.

Turning now to the drawings, and referring initially to FIG. 1, a blockdiagram depicting an exemplary processor-based device, generallydesignated by the reference numeral 100, is illustrated. The device 100may be any of a variety of different types of devices, such as acomputer, a pager, a cellular telephone, a personal organizer, a controlcircuit, etc. In a typical processor-based device, a processor 102, suchas a microprocessor, controls many of the functions of the device 100.

The device 100 typically includes a power supply 104 that delivers powerto the device. The type of power supply 104 may vary depending on thefunction of the device 100. For instance, if the device 100 is portable,the power supply 104 may advantageously include permanent batteries,replaceable batteries, and/or rechargeable batteries. The power supply104 batteries. The power supply 104 may also include an A/C adapter, sothat the device 100 may be plugged into a wall outlet, for instance. Inaddition, the power supply 104 may also include a D/C adapter, so thatthe device 100 may be plugged into a vehicle's cigarette lighter, aswell. Alternatively, if the power supply 104 is not portable, it may beconfigured with the A/C adapter to be plugged into a wall outlet.

Various other devices may be coupled to the processor 102, dependingupon the functions that the device 100 performs. For instance, a userinterface 106 may be coupled to the processor 102 to receiveinformation. The user interface 106 may include buttons, switches, akeyboard, a light pen, a mouse, and/or a voice recognition system, forinstance. A display 108 may also be coupled to the processor 102 topresent information to the user. The display 108 may include an LCDdisplay, a CRT, LEDs, and/or an audio display. Furthermore, an RFsubsystem/baseband processor 110 may also be coupled to the processor102 to communicate with other devices through a wireless link. The RFsubsystem/baseband processor 110 may include an antenna that is coupledto an RF receiver and to an RF transmitter (not shown). A communicationsport 112 may also be coupled to the processor 102 to communicate withother devices through a physical link. The communications port 112 maybe adapted to couple with one or more input/output (I/O) devices 114,such as a modem, a printer, or a computer, for instance.

Because the processor 102 controls the functioning of the device 100generally under the control of software programming, memory is coupledto the processor 102 to store and to facilitate execution of softwareprograms. For instance, the processor 102 may be coupled to may becoupled to volatile memory 116, which may include dynamic random accessmemory (DRAM) and/or static random access memory (SRAM). The amount ofDRAM and SRAM may depend on the specific design of the device 100. Theprocessor 102 may also be coupled to non-volatile memory 118. Thenon-volatile memory 118 may include a read only memory (ROM), such as anerasable programmable ROM, to be used in conjunction with the volatilememory 116. The size of the ROM is typically selected to be just largeenough to store any necessary operating system, application programs,and fixed data. The volatile memory 116, on the other hand, is typicallyquite large so that it can store dynamically loaded applications.Additionally, the non-volatile memory 118 may include a high capacitymemory, such as a disk or a tape drive memory.

In operating the processor-based device 100, it may be advantageous toconserve power so that the device 100 may remain active longer. As such,the components of the device 100 may be designed to reduce redundantcomponents, to operate more efficiently, and to consume less power. Forinstance, the volatile memory 116 may be designed to remove duplicativecircuits or to share circuits when the device 100 is operating indifferent modes, such as a power-up mode, an idle mode, an activationmode, a read/write burst mode, a standby mode, or a power-down mode. Byreducing the duplicative circuits, the power lost or consumed by theredundant circuits may be eliminated, as described further below. As aresult, the device 100 may remain active for longer periods of time andmay operate more efficiently on a limited power source.

In addition, each of the components associated with the device 100 mayhave different different activation time periods before which thecomponent may become operational. For instance, the volatile memory 116may become active after the communication port 112 because differentsections of the volatile memory 116 have different activation timeperiods that prolong its activation. To reduce the delay in activatingthe device 100, the volatile memory 116 may be designed to maintain avoltage on various components or to operate in different modes, whichreduce the amount of time consumed to activate or initialize the device100.

As mentioned previously, a processor-based device 100 may includeintegrated circuits or structures in the semiconductor chips, which areutilized to provide different functionalities to the device 100. Forinstance, the semiconductor chips in the volatile memory 116 may utilizethe power from the power supply 104 to perform specific functions, suchas storing data or software programs. As such, improvements in the powerdistribution in the semiconductor chips may reduce the power consumed bythe volatile memory 116 and provide faster access to the informationstored in the volatile memory 116. The power distribution in asemiconductor chip is explained in greater detail with FIG. 2.

Turning now to FIG. 2, a block diagram of an exemplary embodiment of apower distribution system in a semiconductor chip is illustrated. Inthis power distribution system 200, a semiconductor chip 202, which maybe a portion of the processor-based device 100 of FIG. 1, may receivepower from the power supply 104, which is discussed above in FIG. 1. Thepower delivered to the semiconductor chip 202 may be distributed to twodifferent sections of the chip to two different sections of the chip202, which may include an array section and a periphery section. Thearray section may include memory banks for DRAM, SRAM, or other memorytypes. The periphery section may include circuitry and other structuresused to support the array section, such as drivers, interconnectsbetween circuitry, decoders or other similar circuitry.

The array and periphery sections of the semiconductor chip 202 may alsoinclude components to distribute power within the semiconductor chip202. For instance, power may be delivered from the power supply 104 toan array power amplifier 204 and a periphery power amplifier 206. Eachof the power amplifiers 204 and 206 may represent multiple poweramplifiers or power regulators that are assigned to different sectionsof the chip 202. The power amplifiers 204 and 206 may modify the voltageand drive it to a respective array voltage bus 208 or a peripheryvoltage bus 210. The array voltage bus 208 may apply a specified voltageto an array circuitry 212, while the periphery voltage bus 210 may applya specified voltage to a peripheral circuitry 214. Also, the arrayvoltage bus 208 may connect to an array standby power amplifier 216 thatsupplies the array voltage bus 208 with voltage when the semiconductorchip 202 is in a standby mode. The periphery voltage bus 210 may includea periphery standby power amplifier 218 that supplies the peripherycircuitry 214 with voltage when the semiconductor chip 202 is in astandby mode.

During the normal mode of operation, which may include an activationmode or a read/write burst mode, the voltage buses 208 and 210 maysupply different voltages to the circuitry 212 and 214. The activationmode may include executing commands in the array circuitry 212 and theperiphery circuitry 214, while the read/write mode may include accessingdata from or providing data to the array circuitry 212 and the peripherycircuitry 214. In these modes, a first voltage may be applied to thearray circuitry 212 from the array voltage bus 208, while a secondvoltage may be applied to the periphery circuitry 214 from the peripheryvoltage bus 210. The voltages applied to the array circuitry 212 andperiphery circuitry 214 may be different because each of the circuitshas a different capacitance. The capacitances differ because eachcircuitry 212 and 214 has different components coupled to the respectivecircuitry 212 and 214. As a result, the voltage levels on the arraycircuitry 212 and the periphery circuitry 214 may differ, which mayproduce errors within the semiconductor chip 202.

Also, during a standby or an inactive mode of operation, which mayinclude a power-up mode, an idle mode, a standby mode, and/or apower-down mode, the voltage buses 208 and 210 may provide differentvoltages to the circuitry 212 and 214. The standby mode may maintainpower to specific components, while other components are shut down. Thepower-up mode may distribute power to the various components within thearray circuitry 212 and the periphery circuitry 214, while thepower-down mode may reduce or stop the voltage from being applied tocomponents within the array circuitry 212 and the periphery circuitry214. The idle mode may maintain power to the various components, whilewaiting for other instructions to be received. With each of these modes,a first voltage may be provided to the array circuitry 212 from thearray standby amplifier 216, while a second voltage may be provided tothe periphery circuitry 214 from the periphery standby amplifier 218.During these modes, the voltages the periphery standby amplifier 218.During these modes, the voltages applied to the array circuitry 212 andperiphery circuitry 214 may also be different because the array standbyamplifier 216 and the periphery standby amplifier 218 are each isolatedfrom one another and depend on the respective capacitances of thecircuitry 212 and 214. As a result of these voltage differences,operational problems may again be present in the array circuitry 212 andthe periphery circuitry 214.

In addition, in each of these modes, the array circuitry 212 and theperiphery circuitry 214 may each have redundant power amplifiers 204 and206 and standby amplifiers 216 and 218 that provide duplicative servicesfor the respective circuitry 212 and 214. As a result, each of the poweramplifiers 204 and 206 and standby power amplifiers 216 and 218 mayconsume additional amounts of power. As such, the redundant componentsmay further increase the power consumed by the semiconductor chip 202.

To enhance the operation of the semiconductor chip 202, a bridge circuitmay be implemented that enables the voltage buses 208 and 210 to sharecomponents and to maintain the same voltage level on each of the voltagebuses 208 and 210. The bridge circuit may act as a short during certainmodes to allow components, such as power amplifiers 204 and 206 andstandby power amplifiers 216 and 218 to share components whilemaintaining redundancy. Also, by acting as a short, the bridge circuitmay equalize the voltage between the array circuitry 212 and peripherycircuitry 214 to minimize the errors that result from different voltagesbeing applied to the circuitry 212 and 214. Alternatively, the bridgecircuit may isolate Alternatively, the bridge circuit may isolate thebuses 208 and 210 from each other during other modes. An alternativeexemplary embodiment relating to the distribution of power in asemiconductor chip with components, such as a bridge circuit, isexplained in greater detail with respect to FIG. 3.

In FIG. 3, a block diagram depicting an alternative exemplary embodimentof the power distribution in a semiconductor chip is illustrated. Inthis diagram 300, a semiconductor chip 302, which may be a portion ofthe processor-based device 100 of FIG. 1, may include a bridge circuit304 to improve the operation of the semiconductor chip 302. Similar tothe semiconductor chip 202 in FIG. 2, the semiconductor chip 302 mayinclude various amplifiers 204, 206, and 218, buses 208 and 210, andcircuitry 212 and 214, which may function as discussed above with regardto FIG. 2. Also, the semiconductor chip 302 may receive power from thepower supply 104 in a manner similar to the semiconductor chip 202 (FIG.2).

However, to provide enhanced functionality, the bridge circuit 304 maybe coupled between the array power amplifier 204 and the array voltagebus 208 at a node 306 and coupled between the periphery power amplifier206 and the periphery voltage bus 210 at a node 308. By coupling thebridge circuit 304 between the power amplifiers 204 and 206 andrespective voltage buses 208 and 210, the voltages applied to the arraycircuitry 212 and the periphery circuitry 214 may be maintained atapproximately the same level in certain modes of operation. In othermodes of operation, however, the bridge circuit 304 may remain open toprovide isolation. The isolation may prevent noise from one of the buses208 and 210 from affecting the buses 208 and 210 from affecting thesensitive circuitry on the other bus 208 and 210. For instance, byisolating the buses 208 and 210, the bridge circuit 304 may preventnoise on the array voltage bus 208 from interfering with the operationof periphery circuitry 214 that is sensitive to voltage fluctuations.Thus, the bridge circuit 304 may enhance the operation of thesemiconductor chip 302.

For instance, during the normal mode of operation, which may include theactivation mode or the read/write burst mode, the power amplifiers 204and/or 206 may apply voltages to the array circuitry 212 and theperiphery circuitry 214, respectively. If the bridge circuit 304 isclosed, the bridge circuit 304 may short the two voltage buses 208 and210 together. In this instance, the voltage applied to the arraycircuitry 212 and periphery circuitry 214 is approximately equal becausethe voltage buses 208 and 210 are coupled together by the bridge circuit304. As such, the errors resulting from voltage variations in thecircuitry 212 and 214 may be reduced. In addition, the array circuitry212 and periphery circuitry 214 may share the standby amplifier 218and/or power amplifiers 204 and 206, which may reduce the amount ofpower consumed by redundant components within the semiconductor chip302. The sharing of standby amplifier 218 or power amplifiers 204 and206 may allow the voltage buses 208 and 210 to share components andstill provide some redundancy. Conversely, if the bridge circuit 304 isopen, then the voltage buses 208 and 210 may be isolated from oneanother to provide protection between the buses 208 and 210 for noiseisolation, for example.

During the standby mode of operation, which may include a power-up mode,an idle idle mode, a standby mode, and/or a power-down mode, the bridgecircuit 304 may be closed to act as a short, and the standby amplifier218 may supply power to the array circuitry 212 and the peripherycircuitry 214. As with the normal mode of operation, the voltage appliedto the array circuitry 212 and periphery circuitry 214 may besubstantially equal because the standby amplifier 218 is supplying powerto the array 212 and periphery circuitry 214. As such, the operation ofthe circuitry 212 and 214 may be enhanced because operational problemsassociated with differences in voltage levels on the different circuitry212 and 214 may be reduced.

In addition, it should be noted that the standby power amplifier 218 maybe removed and the standby power amplifier 216 may be attached to thearray circuitry 216 in an alternative embodiment. In this embodiment,the standby power amplifier 216 may supply power from the arraycircuitry 212 to the periphery circuitry 214 to provide the advantagediscussed above. For a better understanding of the operation of thebridging circuit 304, a more detailed embodiment of the powerdistribution system in a semiconductor chip 302 is explained with regardto the different modes of operation in FIG. 4.

A block diagram depicting a more detailed embodiment of the bridgingcircuit along with the various other components in a semiconductor chip,such as the semiconductor chip 302 of FIG. 3, is illustrated in FIG. 4.In this diagram, a power distribution system 402 of a semiconductor chipis shown. Power may be received by the power distribution system 402, ina manner similar to the discussion in FIG. 3. For instance, power may bedistributed by the instance, power may be distributed by the powerdistribution system 402 through the periphery power amplifier 206 to theperiphery circuitry 214 and an array power amplifier 204 to the arraycircuitry 212. Also, as mentioned above, the power may be distributed tothe array circuitry 212 and the periphery circuitry 214 through thestandby power amplifier 218 during certain modes of operation.

In this embodiment, additional devices may be utilized to providesignals for operating the bridge circuit 304. For instance, one devicethat may be utilized may be a voltage detector 404, which may be coupledto the periphery voltage bus 210. The voltage detector 404 may be usedto determine the voltage level on the periphery voltage bus 210, whichmay be used as an input control signal to the control logic thatdetermines the mode of operation. Additionally, a periphery capacitor406 may represent the capacitance of the periphery voltage bus 210,while an array capacitor 408 may represent the capacitance of the arrayvoltage bus 208. The capacitors 406 and 408 may vary depending on thespecific components in the respective circuits.

Also, the array voltage bus 208 and the periphery voltage bus 210 mayconnect the bridge circuit 304 and other circuitry that is utilized tooperate the bridge circuit 304 together during different modes ofoperation. For instance, the bridge circuit 304, which may be onepossible embodiment of a bridge circuit, may operate to isolate buses208 and 210 or may operate to short buses 208 and 210 together,depending on the specific control signals received by the bridge circuit304. To control the state of the bridge circuit 304, the voltagedetector 404 along with a voltage detector 410 and a regulator control412 may be coupled to the bridge 412 may be coupled to the bridgecircuit 304. The voltage detector 410 may be utilized to monitor voltagelevels on the array voltage bus 208, the periphery voltage bus 210,and/or other buses. The voltage detector 404 or 410 may send a power-upcontrol signal to the bridge circuit 304, which may be utilized toindicate the power-up mode or the initialization mode. The regulatorcontrol 412, which may be coupled to control circuitry and/or theprocessor, may send a control signal to the bridge circuit 304 to placethe bridge circuit 304 into various states or modes, such as power-upmode, idle mode, activation mode, read/write burst mode, standby mode,and power-down mode, for example. In each of these modes, the bridgecircuit 304 may couple the buses 208 and 210 together or may isolate thebuses 208 and 210 from each other, depending on the control signal orcondition sent to the bridge circuit 304.

For example, during the activation and/or the read/write burst modes,power may be delivered to the array voltage bus 208 and the peripheryvoltage bus 210 from the respective power amplifiers 204 and 206. Also,the regulator control 412 or the voltage detector 404 or 410 may send acontrol signal to the bridge circuit 304 that indicates an open circuitcondition. As noted above, the activation mode may include executingcommands in the circuitry 212 and 214, while the read/write mode mayinclude accessing data from or delivering data to the circuitry 212 or214. In each of these modes, the voltage on the array voltage bus 208and the periphery voltage bus 210 may be different because the bridgecircuit 304 is open and the buses 208 and 210 are isolated from theother.

Alternatively, during the standby mode, power may be delivered to thearray voltage bus 208 and the periphery voltage bus 210 through thestandby power amplifier 218. The regulator control 412 or the voltagedetector 404 or 410 may send a control signal to the bridge circuit 304to couple the array voltage bus 208 and the periphery voltage bus 210together. This may allow the standby mode to maintain power to specificcomponents, while other components are shut down. As such, the voltageapplied to the array voltage bus 208 and the periphery voltage bus 210may be about the same because the bridge circuit 304 couples the buses208 and 210 together.

Also, during the power-up mode, the idle mode, and the power-down mode,power may be delivered to buses 208 and 210 through the respective poweramplifiers 204 and 206. The regulator control 412 or the voltagedetector 404 or 410 may each send a control signal to the bridge circuit304 to couple the array voltage bus 208 and the periphery voltage bus210 together. The power-up mode and power-down mode maydistribute/reduce the power being supplied to various components withinthe array circuitry 212 and the periphery circuitry 214, as discussedabove. Likewise, the idle mode may maintain power to the variouscomponents, while the power distribution system 402 is waiting for otherinstructions to be received. In each of these modes, the voltagesupplied to the buses 208 and 210 may be approximately equal because thebridge circuit 304 couples the buses 208 and 210 together.

Advantageously, by implementing the bridging circuit 304 in thesevarious modes, the power distribution system 402 may enhance theoperation of the semiconductor chip. The bridging circuit 304 may enablethe power distribution system 402 to minimize the amount of powerutilized to operate the semiconductor chip by reducing duplicationcomponents and enabling the buses 208 and 210 to share the poweramplifiers 204 and 206, the standby power amplifier 218, and the voltagedetector 410. The shorting of the voltage buses 208 and 210 may reducenoise, such as current/voltage spikes or drops, and provide access toanother voltage source for each of the circuits.

Furthermore, each of the buses 208 and 210 may also have differentcapacitances, which may effect the time it takes for the buses 208 and210 to reach a predetermined voltage level for operation. As notedabove, these capacitances may be represented by the array capacitor 406and the periphery capacitor 408. For instance, during the power-up modeeach of the array and periphery circuitry 212 and 214 has a differentcapacitance that influences the amount of time it takes to reach acertain voltage. The bridge circuit 304 may improve the operation ofpower distribution system 402 in the semiconductor chip by coupling thebuses 208 and 210 together to reduce the total time it takes for bothbuses 208 and 210 to reach a predetermined operational voltage. Theadvantage of coupling these buses 208 and 210 together with regard tothe ramp-up time is explained in greater detail with respect to FIG. 5.

In FIG. 5, a graph 500, is shown with different illustrations of theramp-up time for different circuits to reach an operational voltage. Theramp-up time period may be the amount of time a circuit uses to reach aspecified voltage that is used to operate the circuit, for instance. Inthe graph 500, a first ramp-up time period 502 may be associated with acircuit that reaches the specified voltage level V at a time t_(A). Asecond ramp-up time period 504 may be associated with a circuit thatreaches the specified voltage level V at a time t_(B), while a thirdramp-up time period 506 may be associated with a circuit that reachesthe specified voltage level V at a time t_(C).

In operating the semiconductor chip, it may be beneficial to reach thevoltage level V in the least amount of time. However, the capacitance ofthe respective circuits, such as the array circuitry 212 and theperiphery circuitry 214, may influence the time it takes for eachcircuit to reach the specified voltage level V. This may be more clearlyunderstood by concurrently viewing FIGS. 4 and 5. For instance, theperiphery voltage bus 210 may have a capacitor 406 that results in aramp-up time period 502, while the array voltage bus 208 may have anarray capacitor 408 that results in a ramp-up time period 506. If thebridge circuit 304 is open, each of the buses 208 and 210 may reach thespecified voltage level V at the different times t_(A) and t_(C).However, if the bridge circuit 304 couples the two buses 208 and 210together, then the buses 208 and 210 may follow the ramp-up time period504 and reach the specified voltage level V at times t_(B). As a result,the power distribution system 402 may decrease the time it takes forboth buses 208 and 210 to reach the specified voltage level V.Accordingly, the power distribution system 402 may reduce the totalamount of time to reach an operational voltage, which may allow thesemiconductor chip to become operational faster. A more detaileddescription of an semiconductor chip to become operational faster. Amore detailed description of an exemplary embodiment of the bridgecircuit 304 that is adapted to provide this flexibility is furtherexplained with reference to FIG. 6.

In FIG. 6, a schematic diagram depicting an exemplary embodiment of abridge circuit 600, which may be used in the semiconductor chip 302 ofFIG. 3 or the power distribution system 402 of FIG. 4, is illustrated.For clarity, FIG. 6 should be viewed concurrently with FIGS. 3 and 4 toprovide a better understanding of the connectivity and operation of thebridge circuit 600. The bridge circuit 600 may include a first portion601 that receives control signals and a second portion 603 that isolatesthe buses 208 and 210 from each other or couples the buses 208 and 210together. The first section 601 may include a first input 602 and asecond input 604 of the bridge circuit 600, which may receive controlsignals. The first input 602 may be coupled to a logic device 606, suchas a “NAND” gate, and be adapted to receive a first control signal. Asan example, the first control signal may be a power-up control signaldelivered from the voltage detector 410 to indicate the power-up mode.The second input 604 may be coupled to a first inverter 608 and isadapted to receive a second control signal, which may indicate thepower-up mode, the idle mode, the activation mode, the read/write burstmode, the standby mode, and/or the power-down mode. The second controlsignal may be delivered from the regulator control 412. The firstinverter 608 may convert the second control signal to a “high” or “low”signal that is opposite of the signal received. The inverted secondcontrol signal is then delivered to the logic device 606. The logicdevice 606 may receive the first control signal and the inverted secondcontrol signal and combine the signals into an output signal.

Once the output signal is generated, it may be delivered to the secondsection 603 of the bridge circuit 600 to isolate buses 208 and 210 fromeach other or to couple the buses 208 and 210 together. The outputsignal is delivered to a second inverter 610, which converts the outputsignal from a “low” or a “high” signal to a signal that is the oppositeof the signal received. The inverted output signal is then delivered toa logic gate 612, which is coupled between a first output 614 and asecond output 616. As an exemplary embodiment, the logic gate 612 may bea P-channel (MOSFET) transistor with a gate connected to the output ofthe second inverter 610 and a source and a drain connected to the buses208 and 210, respectively. The first output 614 may connect to theperiphery voltage bus 210 and the second output 616 may connect to thearray voltage bus 208. Once the logic gate 612 receives the invertedoutput signal, the logic gate 612 may open to isolate the buses 208 and210 or may close to couple the buses 208 and 210 together. The operationof the bridge circuit 600 is described below for each of the variousmodes.

For instance, if the first input 602 is a “low” control signal or if thesecond input 604 is a “high” control signal, then the logic gate 612 mayclose to couple the outputs 614 and 616 together. However, if the firstinput 602 is a “high” control signal and the second input 604 is a “low”control signal then the logic gate 612 may remain open, which isolatesoutputs 614 and 616 from each other. In an exemplary embodiment, thepower distribution system 402 may be adapted to provide the power-upcontrol signal on the first input 602, and the activation, read/writeburst, standby, and/or power down control signals on the second input604. In this signals on the second input 604. In this example, thepower-up, activation, and read/write burst control signals are “low”when the associated mode is active and “high” when the associated modeinactive. Conversely, the idle, standby, and power-down control signalsare “high” when the associated mode is active and “low” when theassociated mode is inactive. As a result, the power-up, idle, standby,and power-down control signals couple the buses 208 and 210 together,while the activation, and read/write burst control signals isolate thebuses 208 and 210 from each other. As such, the control signals may bedelivered to the bridge circuit 600 to open or close the logic gate 612.The operation of the bridge circuit 600 may be further described in theprocess flow diagram of FIG. 7.

FIG. 7 is a process flow diagram showing the operation of a bridgecircuit in accordance with embodiments of the present invention. In thediagram, generally referred to by reference numeral 700, a bridgecircuit, such as the bridge circuit 304 or 600, may be implemented andutilized in a device, such as the semiconductor chip 302 of FIG. 3. Theprocess flow diagram may be better understood by concurrently viewingFIGS. 3, 4 and 6. The process begins at block 702. At block 704, theamplifiers 204, 206 or 218 may receive power. As set forth above, theamplifiers 204, 206 or 218 may include multiple power amplifiers thatare associated with specific circuits. At block 706, a voltage may beapplied on a first and a second bus, such as buses 208 and 210. Also,the bridge circuit 304 may receive control signals from the voltagedetector 404 or 410 and/or the regulator control 412. The controlsignals may correspond to the power-up, idle, activation, read/writeburst, standby, and/or power-down mode.

Depending on the control signal received, the bridge circuit 304determines whether to short the buses 208 and 210 together, as shown inblock 710. The opening or closing of the bridge circuit 304 may becontrolled by control signals received by the bridge circuit 304 and thesignal received at the logic gate 612 within the bridge circuit 304. Ifthe control signals indicate that the bridge circuit 304 should couplethe buses 208 and 210, then the first bus 208 and the second bus 210 maybe shorted together through the bridge circuit 304 at block 712. Thecoupling of the buses 208 and 210 may allow the buses 208 and 210 tomaintain a similar voltage and share components, as discussed above.However, if the control signals indicate that the bridge circuit 304should be open, then the buses 208 and 210 may be isolated to maintaindifferent voltages by operating independently of each other, as shown atblock 714. At block 716, the bridge circuit 304 may determine if a powerdown signal, which may indicate that the system is being powered or mayresult from a hard shutdown, has been received. If the bridge circuit304 determines that the power down signal has not been received, thenthe bridge circuit 304 may continue to monitor the control signals atblock 710. However, if a power down signal has been received, theprocess ends at block 718.

While the invention may be susceptible to various modifications andalternative forms, specific embodiments have been shown by way ofexample in the drawings and have been described in detail herein.However, it should be understood that the invention is not intended tobe limited to the particular forms disclosed. Rather, the invention isto cover all modifications, equivalents, and alternatives falling withinthe spirit and scope of the invention as defined by the followingappended claims.

1. A method for distributing power to a memory device, the methodcomprising: providing power to an array voltage bus of the memory deviceand a periphery voltage bus of the memory device; generating a controlsignal indicative of a mode of operation of the memory device; providingthe control signal to a bridge circuit, the bridge circuit being coupledto the array voltage bus and the periphery voltage bus; and operatingthe bridge circuit in response to the control signal.
 2. The method ofclaim 1, wherein during a first mode providing power to the arrayvoltage bus comprises providing power through an array power amplifierand providing power to the periphery voltage bus comprises providingpower through a periphery power amplifier.
 3. The method of claim 1,wherein during a second mode providing power to the array voltage busand the periphery voltage bus comprises providing power through astandby power amplifier.
 4. The method of claim 1, wherein generating acontrol signal comprises monitoring the status of the array voltage busand the periphery voltage bus.
 5. The method of claim 1, whereingenerating a control signal comprises providing a status indicator froma regulator control.
 6. The method of claim 1 wherein operating thebridge circuit comprises coupling the array voltage bus and theperiphery voltage bus during a second mode.
 7. The method of claim 1,wherein operating the bridge circuit comprises isolating the arrayvoltage bus and the periphery voltage bus during a first mode.
 8. Amemory device comprising: a first voltage bus coupled to a first sectionof the memory device; a second voltage bus coupled to a second sectionof the memory device, the first and second voltage buses being isolatedfrom each other; and a circuit configured to couple the first voltagebus and the second voltage bus in response to a control signal.
 9. Thememory device of claim 8, wherein the first section of the memory deviceis an array of memory cells and the first voltage bus is an arrayvoltage bus.
 10. The memory device of claim 8, wherein the secondsection of the memory device is a periphery section and the secondvoltage bus is a periphery voltage bus.
 11. The memory device of claim8, wherein the control signal indicates a mode of operation of thememory device.
 12. The memory device of claim 11, wherein the controlsignal is generated by detecting the voltage present on the first andsecond voltage buses.
 13. The memory device of claim 11, wherein thecontrol signal is generated by a regulator control.
 14. The memorydevice of claim 8, wherein the circuit configured to couple the firstand second voltage buses is coupled to a voltage detector and aregulator control.
 15. A system comprising: a processor; and a memorydevice coupled to the processor comprising: a plurality of voltage busesconfigured to receive a voltage from a power supply; and a bridgecircuit coupled to the plurality of voltage buses, wherein the bridgecircuit is configured to isolate or couple the plurality of voltagebuses in response to a control signal.
 16. The system of claim 15,wherein a plurality of voltage buses comprises array and peripheryvoltage buses.
 17. The system of claim 15, wherein the plurality ofvoltage buses are electrically isolated if the control signal is in afirst mode of operation.
 18. The system of claim 15, wherein the bridgecircuit couples the plurality of voltage buses during a standby mode.19. The system of claim 15, wherein the control signal indicates avoltage level of the plurality of voltage buses.
 20. The system of claim15 wherein the control signal indicates an operating mode of the memorydevice.